Semiconductor Overview
NEHP Reduces Tool Installation Time to Wafer Out
NEHP provides modular solutions for manufacturing that are configurable to specific tool applications. Until recently, the Semiconductor Industry has had to stick-build the support systems for manufacturing equipment. NEHP simplifies that process, and saves time and money for our clients by using pre-designed modules. This modular method for 200mm and 300mm tools was developed by NEHP for fast and easy integration into your pre-existing process while simplifying design, pre-purchase, and installation.
NEHP Tool-Specific Module Samples
- Inert Gas Floor Module
- download sample data sheet
- PCW Floor Module
- download sample data sheet
- Chemical Floor Module
- download sample data sheet
- DI Floor Module
- download sample data sheet
- View Tile
- download sample data sheet
- Safety Frame for RAF
- download sample data sheet
- Sub-fab Utility Module
- download sample data sheet
- Sub-fab DI Utility Module
- download sample data sheet
- Vacuum Pump Module
- download sample data sheet
Modules Available by Tool Type
NEHP modules are pre-designed and customized for specific tool types. To find out what modules are available for your tool type, first select the OEM of your tool type from the list below. Contact us if you do not see your tool type maker, as we may be able to provide a module for your needs.
- Applied Materials
- ASML
- Canon
- DNS
- FSI
- Hitachi
- KLA Tencor
- Kokusai
- Lam Research
- Nikon Precision
- Novellus
- Sez
- TEL
- ThermaWave
- Varian
Learn more about modularization.