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FM2 Series Floor Module
This module is engineered and built to drop right into a 2 by 4 foot opening in any raised floor within a semiconductor fabrication facility. It is used to completely replace the stick-built portion of the Process Cooling Water supplied to any type tool used in the industry. It is essentially the same as the FM 1, built side by side. It is available as drop-in or with telescoping, pedestal feet.
It can be ordered with header sizes up to 2"; various valve configurations such as ball or diaphragm; with or without pressure regulators; several types of connection points such as barbed fittings, NPT, PVC socket or quick-disconnects.
We can also custom design any type water module for your needs.
Click on the link above the picture to download a spec sheet for this product.
Please call us or use the contact form if you require further information.
- Heavy Duty 1/4 inch powder-coated steel
- Custom colors to match your application
- Bullet-proof 1" thick lexan
- Lockable latches for safety
Field Replaceable PCW Sticks
Individual Flow, Balance, Pressure, Temperature & Shut-off for each connection
Robust Header and Stick Design
Replaces Standard Raised Floor Tiles
Available with Telescopic Frame or Full Containment enclosure
Reduce on-Site Cost, Labor, and Risk
|Temperature Rating:||10°F (-12°C) to 200°F (90°C)*|
|Pressure Rating:||150 psig (10 bar) @ 70°F (21°C)|
|Regulator Outlet Range (optional):||10 psig (0.5 bar) to 100 psig (7 bar)|